Printed Wiring Board for Mounting Electronic Components and Semiconductor Device Using Same

ABSTRACT

A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via is connected with the wiring pattern and the other end portion is overlaid with a covering layer obtained by applying a conductive paste to cover at least the boundary between the filled via and the insulating layer; alternatively, a plating resist is formed at the other end portion to cover at least the boundary between the filled via and the insulating layer, and is removed after an end portion of the filled via enclosed within the plating resist is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via and the insulating layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of co-pending U.S. patent applicationSer. No. 10/991,921 filed Nov. 18, 2004, which claimed priority toJapanese Patent Application Nos. 2003-392955 filed 21 Nov. 2003 and JP2003-407811 filed 5 Dec. 2003, which are incorporated by referenceherein in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a printed wiring board for mountingelectronic components that allows for the mounting of semiconductorchips such as ICs and LSIs and passive components such as capacitors andresistors on one printed wiring board. Such boards are for example filmcarrier tapes for the mounting of electronic components such as TAB(tape automated bonding) tapes, COF (chip on film) tapes, CSP (chip sizepackage) tapes and BGA (ball grid array) tapes, FPC (flexible printedcircuits) and rigid substrate PWB (printed wiring boards). The inventionalso pertains to a production process of the printed wiring board, and asemiconductor device fabricated with the printed wiring board.

2. Description of Related Art

Various types of printed wiring boards are employed for mountingelectronic components in liquid crystal devices of personal computersand cellular phones, and in printers. These printed wiring boards areproduced by a series of steps in which at least one major surface of aflexible insulating film such as a polyimide film or a rigid insulatingplate such as a glass epoxy plate is overlaid with a conductive metallayer, the conductive metal layer is coated with a photosensitive resin,the photosensitive resin is photoexposed and patterned in desiredconfiguration, the conductive metal layer is etched using thephotopatterned resin as a mask to create a wiring pattern of theconductive metal, a solder resist is applied on the wiring patternexcept terminals (inner leads) that make contact with electroniccomponents mounted thereon and terminals (outer leads) that are incommunication with the inner leads and are connected with the outside,the solder resist is cured, and the inner and outer leads are platedwith tin or the like.

On the thus-prepared printed wiring board for mounting electroniccomponents, a semiconductor chip is placed such that the bump electrodesformed on the chip are contacted with the inner leads, and the bumpelectrodes and the inner leads are electrically connected using abonding tool. Mounting of an electronic component on the printed wiringboard is thus accomplished.

In recent years, semiconductor devices are used in which semiconductorchips such as ICs and LSIs and passive components such as capacitors andresistors are mounted on one printed wiring board (see, for example,JP-A-2003-124601).

Miniaturization and weight reduction of electronic equipment havecreated demands for higher mounting density of electronic components. Inthe semiconductor devices, increasing the mounting density results inintersection of wirings among the mounted components, and therefore theelectrical connection of these components by wirings can not beaccomplished. To overcome such problems, double-sided printed wiringboards have been employed such as 2 metal TAB tapes and 2 metal FPC inwhich wiring patterns are provided on both surfaces of an insulatinglayer and the patterns on the both surfaces are connected through viasin a highway crossing configuration.

The double-sided printed wiring boards, however, have high costs becausewiring patterns must be formed on one surface and then the other.Therefore, it has been worked out for increasing the mounting densitythat a wiring pattern is created only on one surface of the insulatinglayer, and a component is mounted on the reverse surface of the wiringpattern-formed surface through a via when the connections will cross oneanother.

In an etching treatment for forming a wiring pattern or a tin or goldplating treatment, however, an etching or a plating solution or a rinseliquid for removing the treatment solution leaks in a gap between thefilled via and the insulating layer. The acidic plating solution or thelike remained in the gap can leak out therefrom in the post processes,or such residual liquid evaporates and expands with heat applied whenbonding a semiconductor chip or applied in the other process, resultingin a small explosion.

The present invention solves the aforesaid problems of the backgroundart. It is therefore an object of the invention to provide a printedwiring board for mounting electronic components which includes aninsulating layer and a wiring pattern formed on one surface of theinsulating layer and in which an electronic component can be mounted onthe reverse surface of the wiring pattern-formed surface through afilled via, wherein a wet processing liquid such as an etching or aplating solution is prevented from leaking in a gap between the filledvia and the insulating layer. The invention also provides a productionprocess for making the printed wiring board as well as a semiconductordevice fabricated using the printed wiring board.

SUMMARY OF THE INVENTION

A printed wiring board for mounting electronic components according tothe present invention comprises an insulating layer and a wiring patternof a conductive metal that is formed on one surface of the insulatinglayer, wherein a through-hole perforating the insulating layer and thewiring pattern is filled with an implanting conductive material to forma filled via, one end portion of the filled via is connected with thewiring pattern, and the other end portion of the filled via is overlaidwith a covering layer obtained by applying a conductive paste to coverat least the boundary between the filled via and the insulating layer.

Preferably, a deposited coating layer by plating with a conductive metalis formed over the covering layer. Also preferably, a deposited coatinglayer by plating with the conductive metal is formed over an end portionof the filled via on the wiring pattern side to cover at least theboundary between the filled via and the wiring pattern.

A printed wiring board for mounting electronic components according tothe present invention comprises an insulating layer and a wiring patternof a conductive metal that is formed on one surface of the insulatinglayer, wherein a through-hole perforating the insulating layer and thewiring pattern is filled with an implanting conductive material to forma filled via, one end portion of the filled via is connected with thewiring pattern, and a deposited terminal layer is formed on a centralarea of the other end portion of the filled via.

Preferably, the deposited terminal layer is formed on a depositedcoating layer formed on a central area of the end portion of the filledvia. Also preferably, a deposited coating layer is formed over an endportion of the filled via on the wiring pattern side to cover at leastthe boundary between the filled via and the wiring pattern.

The printed wiring boards of the present invention can prevent leakageof a wet processing liquid such as an etching or a plating solution or arinse liquid for the processing liquid into a gap between the filled viaand the insulating layer. Accordingly, high quality semiconductordevices may be produced in high yields.

A semiconductor device according to the present invention is fabricatedusing any of the printed wiring boards as described above. In thesemiconductor device, a semiconductor chip and/or a passive component(electronic component) can be mounted on the reverse surface of thewiring pattern-formed surface.

In the semiconductor device fabricated using the printed wiring board inwhich the deposited terminal layer is formed on the end portion of thefilled via, it is preferred that a semiconductor chip and/or a passivecomponent is mounted on the reverse surface of the wiring pattern-formedsurface, and that, in the end portion of the filled via on the sidewhere the semiconductor chip and/or the passive component is bonded, anouter periphery of the central area in which the deposited terminallayer is formed is coated with solder to cover at least the boundarybetween the filled via and the insulating layer.

In the semiconductor device of the invention, a wiring pattern isprovided on one surface and electronic components are mounted on bothsurfaces of the printed wiring board. Accordingly, the semiconductordevice has low production costs and high packaging density. Further, asa result that the outer periphery of the end portion of the filled viaconnected with the electronic components, and the insulating layer arecovered with solder, the implanting material is reinforced and isprevented from removing from the via hole (through-hole).

A process for producing a printed wiring board for mounting electroniccomponents according to the present invention is for fabricating aprinted wiring board comprising an insulating layer and a wiring patternof a conductive metal that is formed on one surface of the insulatinglayer, the process comprising:

perforating an insulating layer and a wiring pattern or a conductivemetal layer for forming a wiring pattern, and filling the resultant viahole with an implanting conductive material to form a filled via;

applying a conductive paste to an end portion of the filled via on thereverse side of the side where the wiring pattern or the conductivemetal layer is formed, to form a covering layer which covers at leastthe boundary between the filled via and the insulating layer; and

plating the covering layer with a conductive metal.

In one embodiment of the above production process, the covering layermay be plated with a conductive metal in a manner such that the wiringpattern or the conductive metal layer is simultaneously plated with theconductive metal to cover at least the boundary between the filled viaand the wiring pattern or the conductive metal layer.

Another process for producing a printed wiring board for mountingelectronic components according to the present invention is forfabricating a printed wiring board comprising an insulating layer and awiring pattern of a conductive metal that is formed on one surface ofthe insulating layer, the process comprising:

perforating an insulating layer and a wiring pattern or a conductivemetal layer for forming a wiring pattern, and filling the resultant viahole with an implanting conductive material to form a filled via;

forming a plating resist at an end portion of the filled via on thereverse side of the side where the wiring pattern or the conductivemetal layer is formed, to cover at least the boundary between the filledvia and the insulating layer;

plating the end portion of the filled via enclosed within the platingresist to produce a terminal layer; and

removing the plating resist.

The processes preferably comprise plating an end portion of the filledvia on the wiring pattern or conductive metal layer side to cover atleast the boundary between the filled via and the wiring pattern or theconductive metal layer.

In one embodiment of the above production process, the end portion ofthe filled via enclosed within the plating resist may be plated with aconductive metal in a manner such that the wiring pattern or theconductive metal layer is simultaneously plated with the conductivemetal to cover at least the boundary between the filled via and thewiring pattern or the conductive metal layer.

The processes for producing a printed wiring board of the inventionenable prevention of leakage of a wet processing liquid such as anetching or a plating solution or a rinse liquid for the processingliquid in a gap between the filled via and the insulating layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partial sectional view of a printed wiring board formounting electronic components according to an embodiment of theinvention;

FIGS. 2(a) and 2(b) are a set of sectional views illustrating a step ofmaking a filled via with molds, in which

FIG. 2(a) shows a state before an implanting conductive material isfilled by a punch and FIG. 2(b) shows a filled state;

FIG. 3 is a sectional view of the filled via perforating an insulatinglayer and a wiring pattern;

FIG. 4 is a sectional view illustrating a covering layer obtained byapplication of a conductive paste;

FIG. 5(a) is a partial sectional view illustrating the filled via inwhich a caulking punch is driven into an end portion on the wiringpattern side, and FIG. 5(b) is a sectional view showing the filled viain which a caulking part 15 is formed at an end portion on the wiringpattern side;

FIG. 6 is a partial sectional view of a printed wiring board formounting electronic components according to another embodiment of theinvention;

FIG. 7 is a sectional view illustrating a plating resist formed at anend portion on the insulating layer side of the filled via perforatingthe insulating layer and the conductive metal layer;

FIG. 8 is a sectional view of the structure illustrated in FIG. 7 thatis further overlaid with a deposited coating layer and a solder resistlayer and in which the conductive metal layer is patterned into a wiringpattern;

FIG. 9 is a sectional view illustrating a deposited terminal layerenclosed within the plating resist at an end portion of the filled via;and

FIG. 10 is a sectional view illustrating an end portion of the filledvia that is connected with a semiconductor chip and is covered withsolder.

DETAILED DESCRIPTION OF THE INVENTION

Hereinbelow, embodiments of the present invention will be described withreference to the drawings. The printed wiring boards for mountingelectronic components of the invention include film carrier tapes suchas TAB (tape automated bonding) tapes, COF (chip on film) tapes, CSP(chip size package) tapes and BGA (ball grid array) tapes, FPC (flexibleprinted circuits) and rigid substrate PWB (printed wiring boards). Theprinted wiring boards are mainly designed for mounting a semiconductorchip such as IC or LSI together with a passive component such as acapacitor or a resistor on one printed wiring board. The printed wiringboard includes a long, sheet-like or plate-like insulating layer, and awiring pattern of a conductive metal formed on one surface of theinsulating layer. For example, a plurality of wiring patterns is createdalong the longitudinal direction or along the longitudinal and crosswisedirections of the insulating layer.

FIG. 1 is a partial sectional view of the printed wiring board formounting electronic components according to an embodiment of theinvention. As illustrated, a wiring pattern 3 is formed on one surfaceof an insulating layer 2 on which a semiconductor chip, a passivecomponent or the like will be mounted. In a printed wiring board 1 formounting electronic components, a through-hole perforating theinsulating layer 2 and the wiring pattern 3 is created at apredetermined position, and the hole is filled with an implantingconductive material to form a filled via 4. The filled via 4 connects anelectronic component mounted on the reverse surface of the surface onwhich the wiring pattern 3 is formed.

One end portion of the filled via 4 is electrically connected with thewiring pattern 3. The other end portion is overlaid with a coveringlayer 9 formed by applying a conductive paste to cover at least theboundary between the filled via 4 and the insulating layer 2. Thecovering layer 9 is overlaid with a deposited coating layer 6 of aconductive metal such as copper. The deposited coating layer 6 will beplated with tin or the like and thereafter is brought into contact witha terminal of a semiconductor chip or the like.

The insulating layer 2 employed in the invention desirably has chemicalresistance against chemicals such as acids used in etching, and has heatresistance whereby it will not deteriorate by heat applied in bonding.The materials for making the insulating layer 2 include glass epoxy,bismaleimide-triadine, polyester, liquid-crystal polymer, polyamide andpolyimide. In particular, the present invention preferably employs aflexible polyimide film.

The polyimide resins include wholly aromatic polyimides synthesized frompyromellitic dianhydrides and aromatic diamines, and wholly aromaticpolyimides with a biphenyl skeleton synthesized frombiphenyltetracarboxylic dianhydrides and aromatic diamines. Theinsulating layer 2 for use in the present invention generally ranges inthickness from 12.5 to 125 μm, and preferably from 25 to 75 μm.

In the case of a film carrier tape, the insulating layer 2 may beperforated by a punching device to attain necessary through-holes suchas sprocket holes or slits.

The wiring pattern 3 may be produced by a series of steps in which aphotosensitive resin is applied on a conductive metal layer overlaid onone surface of the insulating layer 2, the photosensitive resin isphotoexposed to produce a desired pattern, and the conductive metallayer is etched using the photopatterned resin as a mask. The mask willbe removed by alkali cleaning.

The wiring pattern may be also produced by additive or semi-additivemethod. The wiring pattern may be created before the implanting, afterthe covering layer 9 (described later) has been formed, or after thecovering layer 9 and the deposited coating layer 6 have been produced.To achieve a uniform thickness of the deposited coating layer 6, thewiring pattern 3 is preferably created after the covering layer 9 andthe deposited coating layer 6 have been formed.

The wiring pattern 3 is made of a conductive metal such as copper oraluminum. The conductive metal layer may be obtained by bonding anelectrodeposited copper foil or a rolled copper foil, or by sputtering ametal deposit on a surface-roughed insulating layer, followed byelectrolytic copper plating to thickly cover with copper. The wiringpattern formed may be overall electroless tin plated to preventoxidation on the conductive wiring.

The filled via 4 may be produced by pressing using a set of molds whichincludes a male mold with a punch and a female mold with a die aperturecorresponding to the punch (see Japanese Patent No. 3250988).Specifically, as illustrated in FIG. 2, a conductive metal sheet 11 madeof an implanting conductive material such as copper is overlaid on theinsulating layer 2 on which the wiring pattern 3 has been formed (oroverlaid on a laminate in which an unpatterned conductive metal layer issuperposed on the insulating layer 2). These are then placed on a femalemold 12 (FIG. 2(a)), and a male mold 13 is moved down to punch out theconductive metal sheet 11 and the insulating layer 2 by means of a punch13 a (FIG. 2(b)).

In the above operation, the male mold 13 will descend by a stroke suchthat the lower edge of the punch 13 a is approximately of the same levelas the lower surface of the conductive metal sheet 11. The descent iscontrolled to stop there and whereby only the conductive sheet 11 isperforated. As a result, the insulating layer 2 is punched out by apiece of the conductive sheet 11 that has been pressed down by the punch13 a, with formation of a through-hole. Simultaneously with formation ofthe through-hole, the piece is positioned within the hole and the filledvia 4 is produced. Thereafter, the male mold 13 is moved up and theconductive metal sheet 11 is removed. It is also possible to produce thefilled via by perforating the insulating layer 2 and the wiring pattern3 (conductive metal layer) beforehand, then overlaying the conductivesheet 11, and punching out the conductive sheet 11 to fill a piecepunched out into the via.

The filled via 4 may be also formed by punching out the insulating layer2 with the above-described molds to create a through-hole, and pressinga conductive paste in the hole by screen printing with a metal maskhaving an aperture corresponding to the through-hole, and a squeezee.

The width of the filled via 4 in a transverse direction is generallyfrom 20 to 2000 μm, preferably from 70 to 1000 μm, and more preferablyfrom 80 to 200 μm. The shape of the horizontal cross section of thefilled via is arbitrary, and may be for example a round, elliptical,square or hexagonal shape.

The conductive paste used for forming the covering layer 9 may be adispersion of metal powder such as of silver or copper, carbon powder,or a mixture thereof, in an organic solvent in which a binder resin suchas a thermosetting resin and optionally a curing agent are dissolved.Examples of the conductive pastes include those used for bonding asemiconductor chip terminal such as of IC or LSI with a lead wire of aprinted wiring board.

The conductive paste is applied by screen printing, a dispenser orstamping, then dried and where necessary cured by heating to give thecovering layer (pad) 9. The covering layer 9 is formed in arbitral sizeand shape to cover at least the boundary between the filled via 4 andthe insulating layer 2 to prevent leakage of a tin or gold platingsolution or the like in a gap between the filled via 4 and theinsulating layer 2.

The deposited coating layer 6 is produced over the covering layer 9 byelectrolytic or electroless plating with the same conductive metal as ofthe wiring pattern 3, for example copper. The deposited coating layerenables secure seal of the boundary between the filled via 4 and theinsulating layer 2. The plating may be performed in a manner such that adeposited coating layer 6 is formed also on the wiring pattern 3 tosecurely seal the boundary between the filled via 4 and the wiringpattern 3. The deposited coating layers 6 generally range in thicknessfrom 0.1 to 20 μm, and preferably from 1 to 6 μm.

Hereinbelow, a process of producing the wiring board for mountingelectronic components of the above embodiment will be described in theorder of steps. First, the insulating layer 2 and the wiring pattern 3or the conductive metal layer to be etched for forming the wiringpattern 3, are perforated by the method as described above; thethrough-hole is filled with the implanting conductive material toproduce the filled via 4 (FIG. 3). When the filled via 4 has beenproduced using the conductive metal sheet 11 as illustrated in FIG. 2, acaulking punch 14 may be driven into an end portion of the filled via 4on the wiring pattern 3 side, thereby to expand the end portion outwardas shown in FIG. 5(a). The caulking punches are provided at positionscorresponding to each of the filled vias. Alternatively, as illustratedin FIG. 5(b), the implanting conductive material may be slightlyprotrudent from the through-hole to form a caulking part 15 at the endportion. The caulking punch or part ensures connection between thefilled via 4 and the wiring pattern 3 and prevents a wet processingliquid such as a tin or gold plating solution from leaking into theboundary.

Subsequently, a metal mask perforated at a position corresponding to thefilled via 4 is arranged above the insulating layer 2, and theconductive paste is extruded onto the filled via 4. In one embodiment,the conductive paste may be extruded onto the filled via 4 while movinga squeezee over the metal mask. As a result, the conductive paste isapplied on the end portion of the filled via 4 on the reverse side ofthe wiring pattern 3 (or the conductive metal layer), to cover at leastthe boundary between the filled via 4 and the insulating layer 2. Thepaste applied is then dried or cured by heat to give the covering layer9 (FIG. 4).

Thereafter, the insulating layer 2 in which the filled via 4 is overlaidwith the covering layer 9, is subjected to electrolytic or electrolesscopper plating to produce the deposited coating layer 6 (FIG. 1).

In the case where the wiring pattern 3 has not been formed, theconductive metal layer is patterned into the wiring pattern 3 by aphotolithographic method. Where necessary, the wiring pattern is platedoverall by electroless tin plating. Thereafter, a predetermined area ofthe wiring pattern 3 and a surface of the deposited coating layer 6 areplated with, for example, tin to form terminals that can be stablybonded with semiconductor chip terminals by forming eutectic with thesemiconductor chip terminals.

In general, plating to form terminals is preceded by application andcuring of a solder resist except over the terminals, for protecting thewiring pattern.

The deposited terminal layers formed herein may be selectedappropriately in view of the bonding step that follows. Examples of thesuitable deposited terminal layers include those of tin, gold, solderand nickel, and composite layers thereof. The plating may beaccomplished by electrolytic plating or electroless plating depending onthe conditions. The deposited layers generally have a thickness of 0.1to 10 μm, and preferably 0.2 to 7 μl. Where necessary, a gold bump maybe formed on the tin deposit layer.

The printed wiring board for mounting electronic components according tothe present invention may be fabricated as described above. Thereafter,a semiconductor chip and a passive component are mounted on the wiringpattern 3, and a semiconductor chip and a passive component are mountedon the reverse surface of the surface with the wiring pattern 3 byconnecting their terminals to the respective deposited terminal layers.A semiconductor device may be thus produced.

FIG. 6 is a sectional view of the printed wiring board for mountingelectronic components according to another embodiment of the invention.As illustrated, the wiring pattern 3 is formed on one surface of theinsulating layer 2 on which a semiconductor chip, a passive component orthe like will be mounted. At a predetermined position of the printedwiring board 1, a hole is created through the insulating layer 2 and thewiring pattern 3 and is filled with an implanting conductive material toform the filled via 4. The filled via 4 connects an electronic componentmounted on the reverse surface of the surface on which the wiringpattern 3 is formed. The numeral 6 indicates a deposited coating layerof a conductive metal that covers at least the boundary between thefilled via and the wiring pattern 3. The numeral 8 is a solder resistlayer.

One exposed end portion of the filled via 4 is electrically connectedwith the wiring pattern 3. The other exposed end portion of the filledvia is plated with tin or the like in a central area to have a depositedterminal layer 5, with which a terminal of a semiconductor chip or thelike will be connected.

When the exposed end portion of the filled via 4 on the reverse side ofthe wiring pattern 3 or the conductive metal layer is plated with tin,gold or the like to attain a deposited terminal layer, the platingsolution such as tin or gold plating solution used herein is likely toleak in between the filled via 4 and the insulating layer 2. The sameproblem occurs with an acidic wet processing liquid such as an etchingsolution. The present embodiment prevents this problem by providing aplating resist 7 over the boundary between the filled via 4 and theinsulating layer 2, as illustrated in FIGS. 7 to 9.

The plating resist 7 is applied to a predetermined position by screenprinting or a like method. The plating resist is shaped arbitrarily suchthat it covers at least the boundary between the filled via 4 and theinsulating layer 2 to prevent the plating solution or the like fromleaking in between the filled via 4 and the insulating layer 2, and alsosuch that a part of the end portion surface of the filled via 4 remainsexposed to allow for formation of the deposited terminal layer. Ingeneral, the plating resist 7 is produced with a hollow cross sectionsuch that an inner part of the filled via surface enclosed within theplating resist 7 is exposed for formation of the deposited terminallayer. For example, when the filled via 4 has a circular cross section,the plating resist 7 is shaped like a ring.

The plating resist 7 may be a commercially available screen printableresist. The plating resist should be selected such that it will notdissolve in an acidic wet processing liquid such as a plating or anetching solution, or a rinse liquid for the processing liquid. Theplating resist 7 is removed after the wet processing is completed, forexample after the deposited terminal layer is formed.

The deposited coating layer 6 is formed on the wiring pattern 3 or theconductive metal layer by electrolytic or electroless plating with thesame conductive metal as of the wiring pattern 3, for example copper. Bythe deposited coating layer, secure seal of the boundary between thefilled via 4 and the wiring pattern 3 or the conductive metal layer isachieved. The deposited coating layer 6 generally ranges in thicknessfrom 0.1 to 20 μm, and preferably from 1 to 6 μm. To achieve a uniformthickness of the deposited coating layer 6, the wiring pattern 3 ispreferably created after the deposited coating layer 6 has beenproduced.

Hereinbelow, a process of producing the wiring board for mountingelectronic components of the above embodiment will be described in theorder of steps. First, the insulating layer 2 and the conductive metallayer 3′ to be etched for forming the wiring pattern 3, are perforatedby the method described above; the through-hole is filled with theimplanting conductive material to form the filled via 4 (FIG. 7).

Subsequently, as illustrated in FIG. 7, a metal mask perforated at aposition corresponding to the filled via 4 is arranged above theinsulating layer 2, and the resist coating solution is extruded onto thefilled via 4 while moving a squeezee over the metal mask. As a result,the plating resist 7 is formed on the end portion of the filled via 4 onthe reverse side of the conductive metal layer 3′, such that theboundary between the filled via 4 and the insulating layer 2 is coveredand such that an inner part of the filled via surface enclosed withinthe plating resist is exposed for formation of the deposited terminallayer.

After the plating resist 7 has been created, the conductive metal layer3′ is subjected to electrolytic or electroless copper plating to producea deposited coating layer 6. In the plating, the implanting materialexposed on the end portion surface of the filled via 4 on the reverseside of the wiring pattern-formed surface is also copper plated.Thereafter, the conductive metal layer 3′ is patterned into a wiringpattern by a photolithographic method. Where necessary, the wiringpattern is tin plated overall by electroless tin plating.

In general, before plating is performed to form terminals, a solderresist is applied and cured except over the terminal areas, for thepurpose of protecting the wiring pattern. FIG. 8 illustrates a structurein which the wiring pattern 3 is overlaid with the deposited coatinglayer 6 and further with the solder resist layer 8.

Subsequently, the deposited coating layer 6 on the wiring pattern 3 thatis not covered with the solder resist layer 8, and the deposited coatinglayer 6 formed on the end portion of the filled via 4 surrounded by theplating resist 7, are plated with, for example, tin to form depositedterminal layers 5 that can be stably bonded with semiconductor chipterminals by forming eutectic with the semiconductor chip terminals.

Similarly in the aforesaid embodiment, the deposited terminal layers 5formed herein may be selected appropriately in view of the bonding stepthat follows. Examples of the suitable deposits include those of tin,gold, lead-free solder and nickel, and composite layers thereof. Theplating may be accomplished by electrolytic plating or electrolessplating depending on the conditions. The deposited layers formed hereingenerally have a thickness of 0.1 to 10 μm, and preferably 0.2 to 7 μm.Where necessary, a gold bump may be formed on the tin deposit.

After the deposited terminal layer 5 has been formed, the plating resist7 is removed by alkali cleaning or the like. The printed wiring boardfor mounting electronic components according to the present embodimentmay be thus fabricated. Thereafter, a semiconductor chip and a passivecomponent are mounted on the wiring pattern 3, and a semiconductor chipand a passive component are mounted on the reverse surface of thesurface with the wiring pattern 3 by connecting their terminals to therespective deposited terminal layers. A semiconductor device may be thusproduced.

As shown in FIG. 10, a central area of the end portion of the filled via4 is overlaid with the deposited terminal layer 5 that is bonded with asemiconductor chip 16; solder 17 (preferably lead-free solder) isapplied over the outer periphery of the central area to cover at leastthe boundary between the filled via 4 and the insulating layer 2. As aresult, the implanting material is reinforced and is prevented fromremoving from the via.

The present invention will be hereinafter described by Examplespresented below, but it should be construed that the invention is in noway limited to those Examples.

EXAMPLE 1

A nickel alloy seed layer was sputtered on a 38 μm thick polyimide film,and copper was deposited thereon by plating in 8 μm thickness to give atwo-layer COF substrate. The substrate was overlaid with a copper sheetas an implanting conductive material, and they were perforated at 50positions per one piece of film carrier using a set of molds illustratedin FIG. 2 in a manner such that one end portion of the copper sheetpunched out would connect with the copper layer of the COF substrate,thereby producing filled vias (section width: 100 μm).

A conductive copper paste (trade name: SF-19, available from MitsuiKinzoku Paints & Chemicals Co., Ltd.) was applied by screen printingover 0.5 mm square areas which included each filled via and the adjacentpolyimide film, followed by heat drying. Subsequently, the overallsurface of the copper layer of the COF substrate in which the implantingmaterial had been embedded, and the covering layers obtained byapplication of the copper paste were electrolytically copper plated tocoat these layers with deposited copper.

Thereafter, a photoresist was applied over the film, dried, photoexposedthrough a patterned photomask, and then developed. Etching was performedwith an acidic copper chloride aqueous solution to produce wiringpatterns.

After a solder resist had been applied except over the terminal portionsof the wiring pattern and been cured, the terminal portions of thewiring pattern and the copper deposit coating layers were tin plated inan electroless plating bath containing stannous fluoroborate,alkanesulfonic acid, hypophosphorous acid and so on.

The thus-produced film carrier tape for mounting electronic componentswas reeled and allowed to stand at ordinary temperature. After the lapseof 5 days, the areas to which the copper paste had been applied wereinspected for appearance, but no abnormalities such as corrosion markswere found. Subsequently, one hundred pieces of film carrier were cutout from the film carrier tape and these were sequentially placed on a300° C. hot plate for 10 seconds. Nothing particularly abnormal wasfound with the film carriers.

Thereafter, a capacitor and a resistor were mounted on the wiringpattern of the film carrier fabricated as described above. Meanwhile, abump of an IC chip was connected with the filled via surface on thereverse side to the wiring pattern-formed surface, which filled viasurface had been overlaid with the copper paste-derived layer, thedeposited coating layer and the tin deposit. The components were thensealed with resin to yield a semiconductor device.

EXAMPLE 2

A 12 μm thick electrodeposited copper foil was superposed on a 25 μmthick polyimide film to give a COF substrate. A photoresist was appliedto the substrate, dried, photoexposed through a patterned photomask, andthen developed. Etching was performed with an acidic copper chlorideaqueous solution to create wiring patterns. The substrate was thenoverlaid with a copper sheet as an implanting conductive material, andthey were perforated using a set of molds illustrated in FIG. 2 in amanner such that one end portion of the copper sheet punched out wouldconnect with the wiring pattern, thereby producing filled vias (sectionwidth: 100 μm).

A conductive copper paste (trade name: SF-19, available from MitsuiKinzoku Paints & Chemicals Co., Ltd.) was applied by screen printingover 0.3 mm diameter areas which included each filled via and theadjacent polyimide film, followed by heat drying. Subsequently, thewiring pattern and the copper paste-derived covering layers were copperplated by electrolytic plating to coat these layers with depositedcopper.

After a solder resist had been applied except over the terminal portionsof the wiring pattern and been cured, the predetermined portions of thewiring pattern and the copper deposited coating layers were tin platedby electroless plating as described in Example 1.

The thus-produced film carrier tape for mounting electronic componentswas reeled and allowed to stand at ordinary temperature. After the lapseof 5 days, the areas to which the copper paste had been applied wereinspected, but no abnormalities such as corrosion marks were found.Subsequently, one hundred pieces of film carrier were cut out from thefilm carrier tape and these were sequentially placed on a 300° C. hotplate for 10 seconds. Nothing particularly abnormal was found with thefilm carriers.

Thereafter, a capacitor and a resistor were mounted on the wiringpattern of the film carrier fabricated as described above. Meanwhile, abump of an IC chip was connected with the filled via surface on thereverse side of the wiring pattern-formed surface, which filled viasurface had been overlaid with the copper paste-derived layer, thedeposited coating layer and the tin deposit. The components were thensealed with resin to yield a semiconductor device.

COMPARATIVE EXAMPLE 1

A film carrier tape for mounting electronic components was produced inthe same manner as in Example 1, except that a covering layer wasdeposited without application of the copper paste. One hundred pieces offilm carrier were cut out from the film carrier tape and these wereinspected for appearance as described in Example 1. As a result,corrosion marks were confirmed on three pieces in the one hundred piecesof film carrier. Subsequently, the normal ninety-seven pieces of filmcarrier were sequentially placed on a hot plate as described inExample 1. Seven pieces of film carrier experienced a small explosion,presumably a phreatic explosion.

COMPARATIVE EXAMPLE 2

A film carrier tape for mounting electronic components was produced inthe same manner as in Example 2, except that a covering layer wasdeposited without application of the copper paste. One hundred pieces offilm carrier were cut out from the film carrier tape and these wereinspected for appearance as described in Example 2. As a result,corrosion marks were confirmed on one piece in the one hundred pieces offilm carrier. Subsequently, the normal ninety-nine pieces of filmcarrier were sequentially placed on a hot plate as described in Example2. Six pieces of film carrier experienced a small explosion, presumablya phreatic explosion.

EXAMPLE 3

A nickel alloy seed layer was sputtered on a 38 μm thick polyimide film,and copper was deposited thereon in 8 μm thickness to give a two-layerCOF substrate. The substrate was overlaid with a copper sheet as animplanting conductive material, and they were perforated at 50 positionsper one piece of film carrier using a set of molds illustrated in FIG. 2in a manner such that one end portion of the copper sheet punched outwould connect with the copper layer of the COF substrate, therebyproducing filled vias (section width: 200 μm).

A thermal drying plating resist (trade name: MA-830, available fromTAIYO INK MFG. CO., LTD.) was applied by screen printing to the reversesurface of the surface with the copper layer of the COF substrate, alongthe boundary between the filled via and the adjacent polyimide film soas to seal the gap between them, followed by drying to form a platingresist.

Subsequently, the overall surface of the copper layer of the COFsubstrate in which the implanting material had been embedded waselectrolytically copper plated to cover the boundary between the filledvia and the copper layer of the COF substrate. Simultaneously, the endportion of the filled via exposed on the reverse surface and enclosedwithin the plating resist was electrolytically copper plated.

Thereafter, a photoresist was applied over the copper-plated copperlayer of the COF substrate, then dried, photoexposed through a patternedphotomask, and developed. Etching was performed with an acidic copperchloride aqueous solution to produce wiring patterns.

After a solder resist had been applied except over the terminal portionsof the wiring pattern and been cured, the terminal portions of thewiring pattern and the copper deposited coating layers on the filled viaend surface enclosed within the plating resist, were tin plated in anelectroless plating bath containing stannous fluoroborate,alkanesulfonic acid, hypophosphorous acid and so on. Thereafter, theplating resist surrounding the copper deposited coating layer and thetin deposit was removed.

The thus-produced film carrier tape for mounting electronic componentswas reeled and allowed to stand at ordinary temperature. After the lapseof 5 days, the terminal portions on the reverse surface of the wiringpattern-formed surface were inspected for appearance, but noabnormalities such as corrosion marks were found. Subsequently, onehundred pieces of film carrier were cut from the film carrier tape andthese were sequentially placed on a 300° C. hot plate for 10 seconds.Nothing particularly abnormal was found with the film carriers.

Thereafter, a capacitor and a resistor were mounted on the wiringpattern of the film carrier fabricated as described above. Meanwhile, abump of an IC chip was connected with the tin-plated filled via surfaceon the reverse surface of the wiring pattern-formed surface. Thecomponents were then sealed with resin to yield a semiconductor device.

EXAMPLE 4

A 12 μm thick electrodeposited copper foil was superposed on a 25 μmthick polyimide film to give a COF substrate. A photoresist was appliedto the substrate, dried, photoexposed through a patterned photomask, andthen developed. Etching was performed with an acidic copper chlorideaqueous solution to make wiring patterns. The substrate was thenoverlaid with a copper sheet as an implanting conductive material, andthey were perforated using a set of molds illustrated in FIG. 2 in amanner such that one end portion of the copper sheet punched out wouldconnect with the wiring pattern, thereby producing filled vias (sectionwidth: 200 μm).

The resist employed in Example 3 was applied by screen printing to thereverse surface of the wiring pattern-formed surface of the filled via,along the boundary between the polyimide film and the filled via so asto seal the gap between them, followed by drying to form a platingresist. Subsequently, electrolytic copper plating was carried out tocover the boundary between the filled via and the wiring pattern andsimultaneously to plate the end portion of the filled via exposed on thereverse surface and enclosed within the plating resist.

After a solder resist had been applied except over the terminal portionsof the wiring pattern and been cured, the terminal portions of thewiring pattern and the copper deposit coating layer on the filled viaend surface enclosed within the plating resist, were tin plated byelectroless plating as described in Example 3.

The thus-produced film carrier tape for mounting electronic componentswas reeled and allowed to stand at ordinary temperature. After the lapseof 5 days, the terminal portions on the reverse surface of the wiringpattern-formed surface were inspected for appearance, but noabnormalities such as corrosion marks were found. Subsequently, onehundred pieces of film carrier were cut out from the film carrier tapeand these were sequentially placed on a 300° C. hot plate for 10seconds. Nothing particularly abnormal was found with the film carriers.

Thereafter, a capacitor and a resistor were mounted on the wiringpattern of the film carrier fabricated as described above. Meanwhile, abump of an IC chip was connected with the tin-plated filled via surfaceon the reverse side of the wiring pattern-formed surface. The componentswere then sealed with resin to yield a semiconductor device.

COMPARATIVE EXAMPLE 3

A film carrier tape for mounting electronic components was produced inthe same manner as in Example 3, except that tin plating was performedwithout a plating resist. One hundred pieces of film carrier were cutout from the film carrier tape and these were inspected for appearanceas described in Example 3. As a result, corrosion marks were confirmedon four pieces in the one hundred pieces of film carrier. Subsequently,the normal ninety-six pieces of film carrier were sequentially placed ona hot plate as described in Example 3. Ten pieces of film carrierexperienced a small explosion, presumably a phreatic explosion.

COMPARATIVE EXAMPLE 4

A film carrier tape for mounting electronic components was produced inthe same manner as in Example 4, except that tin plating was performedwithout a plating resist. One hundred pieces of film carrier were cutout from the film carrier tape and these were inspected for appearanceas described in Example 4. As a result, corrosion marks were confirmedon two pieces in the one hundred pieces of film carrier. Subsequently,the normal ninety-eight pieces of film carrier were sequentially placedon a hot plate as described in Example 4. Ten pieces of film carrierexperienced a small explosion, presumably a phreatic explosion.

1. A printed wiring board for mounting electronic components whichcomprises an insulating layer and a wiring pattern of a conductive metalthat is formed on one surface of the insulating layer, wherein athrough-hole perforating the insulating layer and the wiring pattern isfilled with an implanting conductive material to form a filled via, oneend portion of the filled via is connected with the wiring pattern, andthe other end portion of the filled via is overlaid with a coveringlayer obtained by applying a conductive paste to cover at least theboundary between the filled via and the insulating layer.
 2. The printedwiring board according to claim 1, wherein a deposited coating layer byplating with a conductive metal is formed over the covering layer. 3.The printed wiring board according to claim 2, wherein the depositedcoating layer by the plating with the conductive metal is formed over anend portion of the filled via on the wiring pattern side to cover atleast the boundary between the filled via and the wiring pattern.
 4. Aprinted wiring board for mounting electronic components which comprisesan insulating layer and a wiring pattern of a conductive metal that isformed on one surface of the insulating layer, wherein a through-holeperforating the insulating layer and the wiring pattern is filled withan implanting conductive material to form a filled via, one end portionof the filled via is connected with the wiring pattern, and a depositedterminal layer obtained by applying a conductive paste to cover theboundary between the filled via insulating layer is formed on a centralarea of the other end portion of the filled via.
 5. The printed wiringboard according to claim 4, wherein the deposited terminal layer isformed on a deposited coating layer formed by plating the central areaof the end portion of the filled via.
 6. The printed wiring boardaccording to claim 5, wherein the deposited coating layer by the platingis formed over an end portion of the filled via on the wiring patternside to cover at least the boundary between the filled via and thewiring pattern.
 7. A semiconductor device fabricated using the printedwiring board of claim
 1. 8. The semiconductor device according to claim7, wherein a semiconductor chip and/or a passive component is mounted onthe reverse surface of the wiring pattern-formed surface.
 9. Asemiconductor device fabricated using the printed wiring board of claim4, wherein a semiconductor chip and/or a passive component is mounted onthe reverse surface of the wiring pattern-formed surface, and wherein inthe end portion of the filled via on the side where the semiconductorchip and/or the passive component is bonded, an outer periphery of thecentral area in which the deposited terminal layer is formed is coatedwith solder to cover at least the boundary between the filled via andthe insulating layer.
 10. A semiconductor device fabricated using theprinted wiring board of claim
 2. 11. A semiconductor device fabricatedusing the printed wiring board of claim
 3. 12. A semiconductor devicefabricated using the printed wiring board of claim
 4. 13. Asemiconductor device fabricated using the printed wiring board of claim5.
 14. A semiconductor device fabricated using the printed wiring boardof claim
 6. 15. A semiconductor device fabricated using the printedwiring board of claim 5, wherein one or both of a semiconductor chip anda passive component is mounted on the reverse surface of the wiringpattern-formed surface, and wherein in the end portion of the filled viaon the side where one or both of the semiconductor chip and the passivecomponent is bonded, an outer periphery of the central area in which thedeposited terminal layer is formed is coated with solder to cover atleast the boundary between the filled via and the insulating layer. 16.A semiconductor device fabricated using the printed wiring board ofclaim 6, wherein one or both of a semiconductor chip and a passivecomponent is mounted on the reverse surface of the wiring pattern-formedsurface, and wherein in the end portion of the filled via on the sidewhere one or both of the semiconductor chip and the passive component isbonded, an outer periphery of the central area in which the depositedterminal layer is formed is coated with solder to cover at least theboundary between the filled via and the insulating layer.